AMAOE OV-8 0.12mm CPU BGA Reballing Stencil for Compatible OPPO, vivo, realme and iQOO Phones

Name: AMAOE OV-8 0.12mm CPU BGA Reballing Stencil for Compatible OPPO, vivo, realme and iQOO Phones
Brand: AMAOE
SKU: OV-8
Availability: InStock

₹179.00

Brand: AMAOE

Model: OV-8

Availability: In Stock

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Description
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Product Description

The AMAOE OV-8 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and compatible CPU reballing work. Its 0.12 mm thickness is specified in the supplied product title. It helps technicians align solder balls with the chip's BGA layout during rework.

Key Features

Designed for CPU BGA reballing and chip-level repair.
0.12 mm stencil thickness as listed by the supplier.
Suitable for compatible processor layouts in selected smartphones.
Helps with solder-ball placement during motherboard repair.

Compatible Devices and IC Models

OPPO: A96
vivo: Y77
realme: 10 Pro
iQOO: U5
IC models listed: SM6375, MT6855V, MT6833V

Product Specifications

Brand: AMAOE
Model: OV-8
Thickness: 0.12 mm
Type: CPU BGA Reballing Stencil
Application: Mobile motherboard repair and CPU reballing

Important Note: Phone models can use different processor configurations depending on region. Confirm the actual IC marking and stencil aperture layout before use.

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🚚 Shipping & Delivery Information

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📦 Estimated Delivery Time

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Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.